Koch Chemie Fine Cut Foam Pad is a professional polishing sponge designed to remove medium defects, eliminate holograms, and deliver a high gloss finish on large surface areas. The 150 mm (6-inch) size ensures fast, homogeneous, and efficient work, especially on hoods, roofs, and large side panels.

Key Features

• ✔ Optimized Open-Pore Structure: The reticulated design maximizes airflow to control heat buildup and extend the compound's working time.
• ✔ Excellent Hologram Removal: Developed to work perfectly with Koch Chemie F6.01 Fine Cut polish for removing light-to-medium scratches and oxidation.
• ✔ Flawless Finish: Its fine texture and balanced firmness provide deep mirror-like gloss, often enabling excellent one-step results.
• ✔ Ergonomic Edge Design: The chamfered edge enhances maneuverability on large panels while minimizing backing plate contact.