Koch Chemie Polish & Sealing Foam Pad is an ultra-soft professional finishing pad engineered for wax application, paint sealants and extreme gloss enhancement processes. Its 126 mm size ensures perfect compatibility with standard polishing machines while distributing sealants evenly across the paint surface for maximum gloss depth and protection durability.

Key Features

• ✔ Ultra Soft Foam Structure: Works safely on delicate paint systems without introducing holograms or micro scratches.
• ✔ Sealant & Wax Specialist: Optimized for Koch Chemie M0.01 Antihologram Polish and S0.02 Sealing Star protection systems.
• ✔ Minimal Product Absorption: Advanced foam architecture minimizes unnecessary wax and sealant consumption.
• ✔ Low Heat Technology: Reticulated open-cell structure maintains airflow and prevents excessive surface temperatures.
• ✔ Perfect Pressure Distribution: Flexible foam evenly spreads pressure across the surface to eliminate clouding risks.
• ✔ Professional Durability: Reinforced velcro backing ensures safe operation on rotary and DA polishing machines.