Koch Chemie Fine Cut Foam Pad is a high-performance polishing sponge specially developed to remove medium defects, eliminate holograms, and impart a deep gloss to the paint surface. The 126 mm (5-inch) size provides professional detailers with the perfect balance for fast and even work across wide panels.

Key Features

• ✔ Optimized Cell Structure: Reticulated open-pore design maximizes airflow, controlling heat buildup and extending compound working time.
• ✔ Excellent Hologram Removal: Perfectly synchronized for use with Koch Chemie F6.01 Fine Cut polish to eliminate light-medium scratches and wash marring.
• ✔ High Stability: The specific foam density ensures even pressure distribution for a smooth, swirl-free finish.
• ✔ Milled Edge Design: The chamfered edge prevents the backing plate from contacting the paint during maneuvering in tight areas.